0 Product Properties Tool - Bonding Materials

Product Properties Tool - Bonding Materials

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  Coefficient of Thermal Expansion 0-100°C ppm/°C 5 (Typical) 
Product NameDielectric Constant 1, @10GHZ (2.5 GHz) TypicalDissipation Factor TAN @10 GHz (2.5 GHz) 1 (Typical)Volume Resistivity Mohm × cm 2 (Typical)Water Absorption D48/50% 3 (Typical)Thermal Conductivity W/m/°K (Typical) 4
50°C ASTM D5470
XYZDensity gm/cm3 (Typical)Flammability Rating UL94Lead-Free Process Compatible 6Press Temperature
2929 Bondply2.94+/-0.050.00307.4x109 (21)0.100.405050501.50NON-FRY232C (450F)
6250 Bonding Film2.320.00131x10100.01220.17---0.93-N135C (275F)
6700 Bonding Film2.350.00251x10120.01220.17---2.10-N232C (450F)
92ML™ Prepreg5.3 (1 MHz)0.011(1 MHz)4.9x1090.12251.6261818272.26V-0Y185C (365F)
COOLSPAN® TECAN/AN/A3.8x10-10 (Conductive)6.004545454.60NON-FRY175C (350F)
RO3003™ Bondply3.00+/-0.040.00101x1070.040.501716252.10V-0Y370C (700F)
RO3006™ Bondply6.15+/-0.150.00201x1050.020.791717242.60V-0Y370C (700F)
RO3010™ Bondply10.20+/-0.300.00221x1050.050.951311162.80V-0Y370C (700F)
RO4450F™3.52+/-0.050.00408.93x1080.090.651917501.83V-0Y175C (350F)
RO4450T™ (0.003")3.23+/-0.050.00392.9x1090.110.502021571.83V-0Y175C (350F)
RO4460G2™6.15+/-0.150.0049.1x1080.130.671518432.22V-0Y175C (350F)
RT/duroid® 6002 Bondply2.94+/-0.040.00121x106<0.100.601616242.10V-0Y370C (700F)

Properties Notes

  1. Measured by IPC-TM-650 method 2.5.5.5 @ ~10 GHz, 23°C. Materials were based on testing raw substrate material. er values and tolerance reported by IPC-TM-650 method 2.5.5.5 are the basis for quality acceptance, but for some products these values may be incorrect for design engineering applications, especially those in microstrip. We recommend that prototype boards of a new design be verified for electrical performance.
  2. Measured by IPC-TM-650 method 2.5.5.5 at ~10GHz modified.
  3. Typical values are mean values derived from populations of measurements involving multiple lots of the specific foil type.
  4. Measured after 48±1 hours immersion at 50±1ºC in accordance with the ASTM D570 standard.
  5. Tested by ASTM C518.
  6. Tested by IPC-TM-650 2.4.41. Values are average over temperature range but not necessarily linear. However for RT/duroid 6002 and TMM grades the response is essentially linear.
  7. The nominal dielectric constant of an 0.060" thick RO3003 laminate as measured by IPC-TM-2.5.5.5 will be 3.04 due to the elimination of biasing caused by air gaps in the test fixture. For further information refer to Rogers' T.R. 5242.
  8. Due to construction limitations, the dielectric constant of 0.005" laminates is 3.06 ± 0.04; 0.010" and 0.015" laminates are 3.02 ± 0.04: TCDK is +5 for the higher Dk range; and for 2.90 TCDK is -15
  9. Rogers' high frequency laminates and prepregs are lead-free process compatible and in accordance with IEC 61249-2-21.
  10. TMM® material test conditions D24/50 (twenty-four hours at 50°C) on 0.050" (1.27mm) thick specimens. TMM13i test condition D48/50.
  11. Design Dk is determined by testing thick microstrip transmission line circuits and reporting the thickness-axis dielectric constant of the raw material without the influence of copper. For more information, refer to the article on the Rogers website titled "The Influence of Test Method, Conductor Profile, and Substrate Anisotropy on the Permittivity Values Required for Accurate Modeling of High Frequency Planar Circuits", which was featured in a publication Sept. 2012. http://www.rogerscorp.com/acs/articles.aspx
  12. Testing conditions: 24 hours @ 23 C, specimens etched free of copper
  13. Available only with LoPro® copper foil
  14. Measured by IPC-TM-650 method 2.5.5.6 .
  15. 2oz available on TC350 Plus only
  16. Values for 2.5 mil thickness.
  17. Estimated
  18. IPC-TM-650.2.5.5.5.1
  19. Test method: ASTM D5470-12 @ 50°C
  20. PR stands for Planar Resistor. Resistive foil, if required, must be specified when ordering 6202PR laminate.
  21. Conditions 125ºC/24 hours. Test method IPC-TM-650 2.5.17.1
  22. Measured after 24+1/2-0 hours immersion at 23 ± 1ºC in accordance with the ASTM D570 standard.
  23. 12 microstrip transmission line test circuit on 0.060" thick laminate.
  24. N/A
  25. (D24/23) IPC TM-650 2.6.2.1
  26. ASTM E1461
  27. 1.0 W/(m•K) based on ASTM E1461
  28. Values for 3 mil thickness.
  29. Measured using differential phase length method at 77GHz.
  30. Value shown is for 1/2 oz ED copper.