Product Properties Tool - Laminate Materials

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	Dielectric Constant, @10GHZ (2.5 GHz) Typical								Coefficient of Thermal Expansion -55° to 288°C ppm/°C (Typical)
Product Name	Process	Design	Dissipation Factor TAN @10 GHz (2.5 GHz) (Typical)	Thermal Coefficient ε_r -50°C to 150°C ppm/°C (Typical) More	Volume Resistivity Mohm (Typical)	Surface Resistivity Mohm (Typical)	Water Absorption D48/50% (Typical)	Thermal Conductivity W/m/°K (Typical) 50°C ASTM D5470	X	Y	Z	Peel Strength 1 oz (35um) ED Foil lbs/in. (N/mm) (Typical)	Density gm/cm³ (Typical)	Flammability Rating UL94	Lead-Free Process Compatible	PIM dBc Typical More
AD250C™	2.50+/-0.04	2.52	0.0013	-117	4.8x10⁸	4.1x10⁷	0.04²²	0.33	47	29	196	14.8 (2.6)	2.28	V-0	Y	-164
AD255C™	2.55+/-0.04	2.60	0.0013	-110	7.4x10⁸	3.6x10⁷	0.03²²	0.35	34	26	196	13.6 (2.4)	2.28	V-0	Y	-164
AD300D™	2.97, 3.03 +/-0.05	2.94, 3.03	0.0021	-73	1.7x10⁸	5.1x10⁷	0.04	0.37	24	23	98	18.3 (3.2)	2.23	V-0	Y	-159
AD350A™	3.50+/-0.05	3.54	0.0033	-57	1.5x10⁹	9.5x10⁷	0.10²²	0.44	18	18	63	14.7 (2.6)	2.43	V-0	Y	-164
AD1000™	10.20+/-0.35*	10.2	0.0023	-380	1.4x10⁹	1.8x10⁹	0.03²²	0.81	8	10	20	12.0 (2.14)	3.20	V-0	Y	-
Anteo™	4.10+/-0.08	4.38	0.005	-21	2.9x10⁹	6.2x10⁷	0.12	0.64	13	16	42	5.3	1.99	V-0	Y	-
CLTE-AT™	3.00+/-0.04	3.0	0.0013	-10	4.3x10⁸	2.0x10⁸	0.03²²	0.64	8	8	20	6.5 (1.16)	2.06	V-0	Y	-
CLTE-MW™	2.94-3.02+/-0.04	3.03-3.10	0.0015	-35	1.3x10⁷	2.5x10⁶	0.03²²	0.42	8	8	30	6.0 (1.1)	2.1	V-0	Y	-
CLTE-XT™	2.94+/-0.03*	2.94	0.0012	-9	4.3x10⁸	2.5x10⁸	0.02²²	0.56	12.7	13.7	40.8	7.2 (1.29)	2.02	V-0	Y	-
CLTE™	2.98+/-0.04	2.98	0.0023	-9	1.4x10⁹	1.3x10⁶	0.04²²	0.50	9.9	9.4	57.9	7.0 (1.25)	2.38	V-0	Y	-
CuClad® 217	2.17, 2.20+/-0.02	2.17, 2.20	0.0009	-151	2.3x10⁸	3.4x10⁶	0.02²²	0.26	29	28	246	14.0 (2.50)	2.23	V-0	Y	-
CuClad® 233	2.33+/-0.02	2.40	0.0013	-171	8.0x10⁸	2.4x10⁶	0.02²²	0.26	23	24	194	14.0 (2.50)	2.26	V-0	Y	-
CuClad® 250	2.40-2.55+/-0.04	2.40-2.60	0.0017	-170	8.0x10⁹	1.5x10⁸	0.03²²	0.25	18	19	177	14.0 (2.50)	2.31	V-0	Y	-
DiClad® 527	2.40-2.60+/-0.04	2.40-2.60	0.0017	-153	1.2x10⁹	4.5x10⁷	0.03²²	0.25	14	21	173	14.0 (2.50)	2.31	V-0	Y	-
DiClad® 870	2.33+/-0.04	2.33	0.0013	-161	1.5x10⁹	3.4x10⁷	0.02²²	0.26	17	29	217	14.0 (2.50)	2.26	V-0	Y	-
DiClad® 880	2.17, 2.20+/-0.02	2.2	0.0009	-160	1.4x10⁹	2.9x10⁶	0.02²²	0.26	25	34	252	14.0 (2.50)	2.23	V-0	Y	-
IsoClad® 917	2.17+/-0.02	2.17	0.0013	-157	1.5x10¹⁰	1.0x10⁹	0.04²²	0.26	46	47	236	10.0 (1.79)	2.23	V-0	Y	-
IsoClad® 933	2.33+/-0.04	2.33	0.0016	-132	3.5x10⁸	1.0x10⁸	0.05²²	0.26	31	35	203	10.0 (1.79)	2.27	V-0	Y	-
Kappa™ 438	4.10+/-0.08	4.38	0.005	-21	2.9x10⁹	6.2x10⁷	0.12	0.64	13	16	42	5.8	1.99	V-0	Y	-
MAGTREX® 555	ε_Γ = 6.5±0.5 μ_Γ = 6.0±0.2	-	See Data Sheet	~+1000	6.15x10⁸	1.74x10⁸	0.25	0.47	22	25	25	3.1	3.45	N/A	Y	-
RO3003G2™	3.00+/-0.04	3.07⁽²⁹⁾	0.0011	-35	1.4x10⁹	2.6x10⁸	0.06	0.43	16	17	18	12.0⁽³⁰⁾	2.15	V-0	Y	-
RO3003™	3.00+/-0.04⁷	3.16²⁹	0.0010	-3	1x10⁷	1x10⁷	0.04	0.50	17	16	25	12.7 (2.2)	2.1	V-0	Y	-
RO3006™	6.15+/-0.15	6.4	0.002	-262	1x10⁵	1x10⁵	0.02	0.79	17	17	24	7.1 (1.2)	2.6	V-0	Y	-
RO3010™	10.20+/-0.30	11.2	0.0022	-395	1x10⁵	1x10⁵	0.05	0.95	13	11	16	9.4 (1.6)	2.8	V-0	Y	-
RO3035™	3.50+/-0.05	3.60	0.0015	-45	1x10⁷	1x10⁷	0.04	0.50	17	17	24	10.2 (1.8)	2.1	V-0	Y	-
RO3203™	3.02 +/- 0.04	3.02	0.0016	-13	1x10⁷	1x10⁷	0.03	0.48	13	13	58	10.2 (1.8)	2.1	V-0	Y	-
RO3206™	6.15+/-0.15	6.6	0.0027	-212	1x10³	1x10³	0.03	0.67	13	13	34	10.7 (1.9)	2.7	V-0	Y	-
RO3210™	10.20+/-0.50	10.8	0.0027	-459	1x10³	1x10³	0.12	0.81	13	13	34	11.0 (1.9)	3	V-0	Y	-
RO4003C™	3.38+/-0.05	3.55	0.0027	40	1.7x10¹⁰	4.2x10⁹	0.04	0.71	11	14	46	6.0 (1.05)	1.8	NON FR	Y	-
RO4350B™	3.48 +/- 0.05	3.66	0.0037	50	1.2x10¹⁰	5.7x10⁹	0.05	0.69	10	12	32	5.0 (0.88)	1.9	V-0	Y	-
RO4360G2™	6.15 +/- 0.15	6.4	0.0038	-131	4x10⁷	9x10⁶	0.08	0.75	13	14	28	5.2 (0.91)	2.16	V-0	Y	-
RO4533™	3.30+/-0.08	3.45	0.0025 (0.0020)	40	1.1x10¹⁰	9.9x10⁸	0.02	0.60	13	11	37	6.9 (1.2)	1.8	NON FR	Y	-157
RO4534™	3.40 +/- 0.08	3.55	0.0027 (0.0022)	40	1.7x10¹⁰	4.2x10⁹	0.06	0.60	11	14	46	6.3 (1.1)	1.8	NON FR	Y	-157
RO4535™	3.44+/-0.08	3.60	0.0037 (0.0032)	50	1.2x10¹⁰	5.7x10⁹	0.09	0.6	16	17	50	5.1 (0.9)	1.9	V-0	Y	-157
RO4725JXR™	2.55+/-0.05	2.64	0.0026 (0.0022)	34	2.16x10⁸	4.8x10⁷	0.24	0.38⁽¹⁹⁾	13.9	19.0	25.6	8.5 (1.49)	1.27	NON FR	Y	≤-160
RO4730G3™	3.00 +/- 0.05	2.98	0.0028	34	9.0x10⁷	7.2x10⁵	0.093	0.45	15.9	14.4	35.2	4.1	1.58	V-0	Y	≤-165
RO4830™	3.25+/-0.05	3.24²⁹	0.0033	-30	9.6x10⁹	1.1x10⁸	0.15	0.45	23	23	110	3.8 (0.67)	1.68	V-0	Y	-
RO4835T™	3.33+/-0.05	3.48	0.0030	35 ppm/C (from -50 to 50C), -35 ppm/C (from 50 to 150C)	1.34x10⁸	1.17x10⁶	0.20	0.53, 0.52@80°	14	16	62	3.0 (0.53)	1.81	V-0	Y	-
RO4835™	3.48+/-0.05	3.66	0.0037	50	5x10⁸	7x10⁸	0.05	0.66	10	12	31	5.0 (0.88)	1.92	V-0	Y	-
RT/duroid® 5870	2.33 +/- 0.02	2.33	0.0012	-115	2x10⁷	2x10⁷	0.02	0.22	22	28	173	27.2 (4.8)	2.2	V-0	Y	-
RT/duroid® 5880	2.20 +/- 0.02	2.20	0.0009	-125	2x10⁷	3x10⁷	0.02	0.20	31	48	237	31.2 (5.5)	2.2	V-0	Y	-
RT/duroid® 5880LZ	2.00 +/- 0.04	2.0	0.0021	20	1.74x10⁷	2.08x10⁶	0.31	0.33	54	47	40	>4.0	1.4	V-0	Y	-
RT/duroid® 6002	2.94+/-0.04	2.94	0.0012	12	1x10⁶	1x10⁷	0.02	0.60	16	16	24	8.9 (1.6)	2.1	V-0	Y	-
RT/duroid® 6006	6.15 +/- 0.15	6.45	0.0027	-410	2x10⁷	7x10⁷	0.05	0.49	47	34	117	14.3 (2.5)	2.7	V-0	Y	-
RT/duroid® 6010.2LM	10.20+/-0.25	10.7	0.0023	-425	5x10⁵	5x10⁶	0.01	0.86	24	24	47	12.3 (2.1)	3.1	V-0	Y	-
RT/duroid® 6035HTC	3.50+/-0.05	3.60	0.0013	-66	1x10⁸	1x10⁸	0.06¹²	1.44	19	19	39	7.9 (1.4)	2.2	V-0	Y	-
RT/duroid® 6202	2.94+/-0.04⁸	2.94+/-0.04⁸	0.0015	+5 to -15⁸	1x10⁶	1x10⁹	0.04	0.68	15	15	30	9.1 (1.6)	2.1	V-0	Y	-
RT/duroid® 6202PR²⁰	2.90-3.00+/-0.04	2.90-3.00	0.0020	+5 to -15⁸	1x10¹⁰	1x10⁹	0.03	0.68	15	15	30	14.3 (2.5)	2.1	V-0	Y	-
TC350™	3.50+/-0.05	3.50	0.0020	-9	7.4x10⁶	3.2x10⁷	0.05⁽²²⁾	0.72, 1.00⁽²⁷⁾	7	7	23	7.0(1.2)	2.3	V-0	Y	-
TC350™ Plus	3.50+/-0.05	3.62	0.0017	-42	9.4x10¹¹	3.3x10¹²	0.05⁽²⁵⁾	1.24	10	9	38	4.0 (0.7)	TBD	V-0	Y	-
TC600™	6.15+/-0.15	6.15	0.0020	-75	1.6x10⁹	3.1x10⁹	0.03⁽²²⁾	1.10	9	9	35	8.0(1.4)	3.0	V-0	Y	-
TMM® 3	3.27 +/- 0.032	3.45	0.0020	37	3x10⁹	9x10⁹	0.06⁽¹⁰⁾	0.70	15	15	23	5.7 (1.0)	1.8	NON FR	Y	-
TMM® 4	4.50+/-0.045	4.7	0.0020	15	6x10^8*	1x10^9*	0.07⁽¹⁰⁾	0.70	16	16	21	5.7 (1.0)	2.1	NON FR	Y	-
TMM® 6	6.00+/-0.08	6.3	0.0023	-11	1x10^8*	1x10⁹	0.06⁽¹⁰⁾	0.72	18	18	26	5.7 (1.0)	2.4	NON FR	Y	-
TMM® 10	9.20 +/- 0.23	9.8	0.0022	-38	2x10⁸	4x10⁷	0.09⁽¹⁰⁾	0.76	21	21	20	5 (0.9)	2.8	NON FR	Y	-
TMM® 10i	9.80+/-0.245	9.9	0.0020	-43	2x10⁸	4x10⁷	0.16⁽¹⁰⁾	0.76	19	19	20	5 (0.9)	2.8	NON FR	Y	-
TMM® 13i	12.85+/-0.35⁽¹⁴⁾	12.2	0.0019	-70	TBD	TBD	0.13	0.76¹⁷	19	19	20	4 (0.7)	3.0	NON FR	Y	-
XtremeSpeed™ RO1200™	3.03-3.10+/-0.10	3.03-3.10	0.0017	-35	1.3x10⁷	2.5x10⁶	0.03	0.42	8	8	30	>4.5(>0.79)	2.1	V-0	Y	-

Properties Notes

Measured by IPC-TM-650 method 2.5.5.5 @ ~10 GHz, 23°C. Materials were based on testing raw substrate material. er values and tolerance reported by IPC-TM-650 method 2.5.5.5 are the basis for quality acceptance, but for some products these values may be incorrect for design engineering applications, especially those in microstrip. We recommend that prototype boards of a new design be verified for electrical performance.
Measured by IPC-TM-650 method 2.5.5.5 at ~10GHz modified.
Typical values are mean values derived from populations of measurements involving multiple lots of the specific foil type.
Measured after 48±1 hours immersion at 50±1ºC in accordance with the ASTM D570 standard.
Tested by ASTM C518.
Tested by IPC-TM-650 2.4.41. Values are average over temperature range but not necessarily linear. However for RT/duroid 6002 and TMM grades the response is essentially linear.
The nominal dielectric constant of an 0.060" thick RO3003 laminate as measured by IPC-TM-2.5.5.5 will be 3.04 due to the elimination of biasing caused by air gaps in the test fixture. For further information refer to Rogers' T.R. 5242.
Due to construction limitations, the dielectric constant of 0.005" laminates is 3.06 ± 0.04; 0.010" and 0.015" laminates are 3.02 ± 0.04: TCDK is +5 for the higher Dk range; and for 2.90 TCDK is -15
Rogers' high frequency laminates and prepregs are lead-free process compatible and in accordance with IEC 61249-2-21.
TMM® material test conditions D24/50 (twenty-four hours at 50°C) on 0.050" (1.27mm) thick specimens. TMM13i test condition D48/50.
Design Dk is determined by testing thick microstrip transmission line circuits and reporting the thickness-axis dielectric constant of the raw material without the influence of copper. For more information, refer to the article on the Rogers website titled "The Influence of Test Method, Conductor Profile, and Substrate Anisotropy on the Permittivity Values Required for Accurate Modeling of High Frequency Planar Circuits", which was featured in a publication Sept. 2012. http://www.rogerscorp.com/acs/articles.aspx
Testing conditions: 24 hours @ 23 C, specimens etched free of copper
Available only with LoPro® copper foil
Measured by IPC-TM-650 method 2.5.5.6 .
2oz available on TC350 Plus only
Values for 2.5 mil thickness.
Estimated
IPC-TM-650.2.5.5.5.1
Test method: ASTM D5470-12 @ 50°C
PR stands for Planar Resistor. Resistive foil, if required, must be specified when ordering 6202PR laminate.
Conditions 125ºC/24 hours. Test method IPC-TM-650 2.5.17.1
Measured after 24+1/2-0 hours immersion at 23 ± 1ºC in accordance with the ASTM D570 standard.
12 microstrip transmission line test circuit on 0.060" thick laminate.
N/A
(D24/23) IPC TM-650 2.6.2.1
ASTM E1461
1.0 W/(m•K) based on ASTM E1461
Values for 3 mil thickness.
Measured using differential phase length method at 77GHz.
Value shown is for 1/2 oz ED copper.

The information is intended to assist you in designing with Rogers’ circuit materials. It is not intended to and does not create any warranties express or implied, including any warranty of merchantability or fitness for a particular purpose or that the results shown will be achieved by a user for a particular purpose. The user should determine the suitability of Rogers’ circuit materials for each application.

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